Invention Grant
- Patent Title: Electron beam measurement apparatus
- Patent Title (中): 电子束测量装置
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Application No.: US12328161Application Date: 2008-12-04
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Publication No.: US07884325B2Publication Date: 2011-02-08
- Inventor: Yasunari Sohda , Shoji Hotta , Shinji Okazaki , Muneyuki Fukuda
- Applicant: Yasunari Sohda , Shoji Hotta , Shinji Okazaki , Muneyuki Fukuda
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, P.C.
- Priority: JP2007-315940 20071206
- Main IPC: G01N23/00
- IPC: G01N23/00 ; G21K7/00

Abstract:
The present invention provides an electron beam measurement technique for measuring the shapes or sizes of portions of patterns on a sample, or detecting a defect or the like. An electron beam measurement apparatus has a unit for irradiating the patterns delineated on a substrate by a multi-exposure method, and classifying the patterns in an acquired image into multiple groups according to an exposure history record. The exposure history record is obtained based on brightness of the patterns and a difference between white bands of the patterns.
Public/Granted literature
- US20090146057A1 ELECTRON BEAM MEASUREMENT APPARATUS Public/Granted day:2009-06-11
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