Invention Grant
- Patent Title: Field effect transistor and its manufacturing method
- Patent Title (中): 场效应晶体管及其制造方法
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Application No.: US12708903Application Date: 2010-02-19
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Publication No.: US07883968B2Publication Date: 2011-02-08
- Inventor: Mizuhisa Nihei
- Applicant: Mizuhisa Nihei
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The present invention is an object to provide a high-performance vertical field effect transistor having a microminiaturized structure in which the distance between the gate and the channel is made short not through a microfabrication process, having a large gate capacitance, and so elaborated that the gate can control the channel current with a low voltage, and a method for simply and efficiently manufacturing such a field effect transistor not through a complex process such as a microfabrication process. The field effect transistor of the present invention comprises a first electrode, a second electrode so arranged as to be electrically insulated from the first electrode, a semiconductive rod-shaped body extending through at least one of the first and second electrodes, provided along the inner wall of a hole in which the first and second electrodes are exposed, and interconnecting the first and second electrodes, and a third electrode at least partially inserted in the hole and opposed to the semiconductive rod-shaped body with an insulating layer interposed between the third electrode and the semiconductive rod-shaped body. The aspect preferably include an aspect in which the thickness of the insulating layer is 50 nm or less and an aspect in which the semiconductive rod-shaped body is a single-wall carbon nanotube.
Public/Granted literature
- US20100151662A1 FIELD EFFECT TRANSISTOR AND ITS MANUFACTURING METHOD Public/Granted day:2010-06-17
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