Invention Grant
US07883739B2 Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
有权
用于加强与金属层相邻形成的介电层之间的附着力的方法
- Patent Title: Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
- Patent Title (中): 用于加强与金属层相邻形成的介电层之间的附着力的方法
-
Application No.: US10462343Application Date: 2003-06-16
-
Publication No.: US07883739B2Publication Date: 2011-02-08
- Inventor: Igor C. Ivanov , Weiguo Zhang , Artur Kolics
- Applicant: Igor C. Ivanov , Weiguo Zhang , Artur Kolics
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Daffer McDaniel, LLP
- Agent Kevin L. Daffer; Mollie E. Lettang
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H01L21/4763

Abstract:
A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to the dielectric layer. Consequently, a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers of hydrophilic and hydrophobic material, respectively. A topography including a metal feature having a single layer with at least four elements lining a lower surface and sidewalls of the metal feature is also provided herein. The fluid/s used to form such a single layer may be analyzed by test equipment configured to measure the concentration of all four elements. In some cases, the composition of the fluid/s may be adjusted based upon the analysis.
Public/Granted literature
- US20040253826A1 Methods for making and processing diffusion barrier layers Public/Granted day:2004-12-16
Information query