Invention Grant
- Patent Title: Substrate treating apparatus and method
- Patent Title (中): 底物处理装置及方法
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Application No.: US12401697Application Date: 2009-03-11
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Publication No.: US07883635B2Publication Date: 2011-02-08
- Inventor: Hiroaki Takahashi
- Applicant: Hiroaki Takahashi
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2005-049044 20050224; JP2005-049045 20050224
- Main IPC: C03C15/00
- IPC: C03C15/00

Abstract:
A substrate treating apparatus for treating substrates with a treating solution having a mixture of a chemical and a diluent. The apparatus includes a treating tank for storing the treating solution, a heating device for heating the treating solution, a supply pipe for supplying a gas at a fixed flow rate, the supply pipe having a detecting end at a predetermined depth in the treating tank, a pressure detecting device for detecting a pressure in the supply pipe, a converting device for converting the pressure detected by the pressure detecting device into a voltage, a storage device for storing, as a reference voltage, a voltage received from the converting device when a reference liquid at a reference temperature is stored in the treating tank, and a computing device for deriving an actual specific gravity of the treating solution from the reference voltage stored in the storage device, and a treatment voltage received from the converting device when the treating solution stored in the treating tank has been heated to a treating temperature by the heating device.
Public/Granted literature
- US20090179008A1 SUBSTRATE TREATING APPARATUS AND METHOD Public/Granted day:2009-07-16
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