Invention Grant
- Patent Title: Waterproof connector for flexible substrate
- Patent Title (中): 防水连接器用于柔性基板
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Application No.: US12835890Application Date: 2010-07-14
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Publication No.: US07883359B2Publication Date: 2011-02-08
- Inventor: Takuya Osaki , Yuji Ishitani , Masahiro Kondo
- Applicant: Takuya Osaki , Yuji Ishitani , Masahiro Kondo
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-005663 20080115; JP2008-307445 20081202
- Main IPC: H01R12/24
- IPC: H01R12/24

Abstract:
A waterproof connector for a flexible substrate includes: a flexible substrate which includes an insulating film with a conductive pattern formed thereon; a connection terminal joined to the conductive pattern at a terminal section of the flexible substrate; a housing which accommodates the connection terminal; a retainer which includes a vertically assembled pair of members, a forward end thereof holding the connecting section of the conductive pattern and the connection terminal and a rear end thereof surrounding the flexible substrate; a hot-melt adhesive provided on an inner circumference of the retainer at non-joint areas with the flexible substrate and provided on an outer circumference of the retainer so as to make the flexible substrate and the retainer adhere closely to each other; engaging member provided in the outer circumference of the retainer; and receiving member provided in the housing. The engaging member and the receiving member are engaged together to fix the retainer and the housing.
Public/Granted literature
- US20100279541A1 WATERPROOF CONNECTOR FOR FLEXIBLE SUBSTRATE Public/Granted day:2010-11-04
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