Invention Grant
- Patent Title: Integrated circuit socket
- Patent Title (中): 集成电路插座
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Application No.: US12089995Application Date: 2006-09-12
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Publication No.: US07883352B2Publication Date: 2011-02-08
- Inventor: Hidenori Taguchi , Shinichi Hashimoto
- Applicant: Hidenori Taguchi , Shinichi Hashimoto
- Applicant Address: JP Kanagawa-Ken
- Assignee: Tyco Electronics Japan G. K.
- Current Assignee: Tyco Electronics Japan G. K.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Barley Snyder LLC
- Priority: JP2005-299168 20051013
- International Application: PCT/JP2006/318025 WO 20060912
- International Announcement: WO2007/043269 WO 20070419
- Main IPC: H01R13/62
- IPC: H01R13/62

Abstract:
An integrated circuit socket includes an insulating housing having a plurality of contact openings arranged in rows and a recess that receives an integrated circuit package. A plurality of contacts arranged in a first contact group and a second contact group in the insulating housing. Each of the contacts has a flat plate fixing member fixed in the contact opening, a connecting member extending from a lower portion of the fixing member, and a spring member extending diagonally upward from an upper portion of the fixing member. The spring member has a contact member extending into the recess. The contacts are arranged in the contact openings such that the spring members are arranged at an angle offset from a direction of arrangement of the rows and the spring arms of the first contact group are arranged in a direction opposing the spring arms of the second contact group.
Public/Granted literature
- US20090280690A1 Integrated Circuit Socket Public/Granted day:2009-11-12
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