Invention Grant
- Patent Title: Socket assembly with pick up cap
- Patent Title (中): 插座装配带上盖
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Application No.: US12386604Application Date: 2009-04-20
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Publication No.: US07883345B2Publication Date: 2011-02-08
- Inventor: Cheng-Chi Yeh , Chia-Wei Fan
- Applicant: Cheng-Chi Yeh , Chia-Wei Fan
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: TW97213403A 20080729
- Main IPC: H01R13/44
- IPC: H01R13/44

Abstract:
A socket assembly comprises a socket and a pick up cap attached on the socket. The socket has an insulative housing with sidewalls, and the sidewalls have a plurality of protrusions extending upwardly and formed with end surfaces. The pick up cap comprises a plurality of cutouts with inner side surfaces. The inner side surface of the cutout abuts against corresponding end surface of insulative housing to position the pick up cap on the insulative housing. An interference force created between the cutout and the protrusion extends along an extending direction of corresponding sidewall.
Public/Granted literature
- US20100029107A1 Socket assembly with pick up cap Public/Granted day:2010-02-04
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