Invention Grant
- Patent Title: Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array
- Patent Title (中): 将二维光电（OE）器件阵列互连（映射）到一维波导阵列
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Application No.: US12117803Application Date: 2008-05-09
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Publication No.: US07883277B2Publication Date: 2011-02-08
- Inventor: Russell A. Budd , Punit P. Chiniwalla , John A. Guckenberger , Jeffrey A. Kash , Jeremy D. Schaub , Michael Tan , Jeannine M. Trewhella , Garry Trott
- Applicant: Russell A. Budd , Punit P. Chiniwalla , John A. Guckenberger , Jeffrey A. Kash , Jeremy D. Schaub , Michael Tan , Jeannine M. Trewhella , Garry Trott
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel Morris, Esq.
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/255
Abstract:
For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.
Public/Granted literature
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