Invention Grant
- Patent Title: IC card and manufacturing method of the same
- Patent Title (中): IC卡和制造方法相同
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Application No.: US12183661Application Date: 2008-07-31
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Publication No.: US07883022B2Publication Date: 2011-02-08
- Inventor: Isao Takahashi , Junichi Sawada
- Applicant: Isao Takahashi , Junichi Sawada
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
An IC card formed by sandwiching a circuit board formed with an antenna pattern and an IC chip mounted on the circuit board with a plurality of card constituent sheets. Ferrite beads to absorb and remove noises (unnecessary radiation energy) input to and output from the IC chip are mounted on wiring sections interconnecting the antenna pattern and IC chip.
Public/Granted literature
- US20090032603A1 IC CARD AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2009-02-05
Information query
