Invention Grant
- Patent Title: Ultra-high density connector
- Patent Title (中): 超高密度连接器
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Application No.: US12604295Application Date: 2009-10-22
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Publication No.: US07881578B2Publication Date: 2011-02-01
- Inventor: Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
- Applicant: Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
- Applicant Address: US MA Waltham
- Assignee: Raytheon Sarcos, LLC
- Current Assignee: Raytheon Sarcos, LLC
- Current Assignee Address: US MA Waltham
- Agency: Thorpe North & Western LLP
- Main IPC: G02B6/04
- IPC: G02B6/04 ; G02B6/36 ; G02B6/38 ; G02B6/40 ; G02B6/06 ; H01R12/00 ; H01R4/66 ; H01R12/24 ; H01R24/00 ; H01R33/945 ; C03B37/15

Abstract:
Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.
Public/Granted literature
- US20100112865A1 Ultra-High Density Connector Public/Granted day:2010-05-06
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