Invention Grant
US07880190B2 Combined semiconductor device, LED print head, and image forming apparatus
有权
组合半导体器件,LED打印头和成像设备
- Patent Title: Combined semiconductor device, LED print head, and image forming apparatus
- Patent Title (中): 组合半导体器件,LED打印头和成像设备
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Application No.: US10936515Application Date: 2004-09-09
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Publication No.: US07880190B2Publication Date: 2011-02-01
- Inventor: Mitsuhiko Ogihara , Ichimatsu Abiko , Masaaki Sakuta
- Applicant: Mitsuhiko Ogihara , Ichimatsu Abiko , Masaaki Sakuta
- Applicant Address: JP Tokyo
- Assignee: Oki Data Corporation
- Current Assignee: Oki Data Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C.
- Priority: JP2003-324200 20030917
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A combined semiconductor apparatus has a substrate, a thin semiconductor film attached directly or indirectly to one major surface of the substrate, and a lens attached to the opposite surface of the substrate. The thin semiconductor film includes a light-emitting element that emits light through the substrate. After passing through the substrate, the emitted light is focused by the lens. The substrate functions as a spacing element, assuring that the lens is positioned at the correct distance from the light-emitting element without the need for separate alignment. The substrate also holds the lens without the need for a separate lens holder. Driving circuitry may also be formed on the substrate.
Public/Granted literature
- US20050057641A1 Combined semiconductor device, LED print head, and image forming apparatus Public/Granted day:2005-03-17
Information query
IPC分类: