Invention Grant
US07865859B2 Implementing APS voltage level activation with secondary chip in stacked-chip technology
有权
在堆叠芯片技术中实现二次芯片的APS电压电平激活
- Patent Title: Implementing APS voltage level activation with secondary chip in stacked-chip technology
- Patent Title (中): 在堆叠芯片技术中实现二次芯片的APS电压电平激活
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Application No.: US11869841Application Date: 2007-10-10
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Publication No.: US07865859B2Publication Date: 2011-01-04
- Inventor: Phil C. Paone , David Paul Paulsen , John Edward Sheets, II , Gregory John Uhlmann
- Applicant: Phil C. Paone , David Paul Paulsen , John Edward Sheets, II , Gregory John Uhlmann
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joan Pennington
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method and apparatus implement adaptive power supply (APS) system voltage level activation eliminating the use of electronic Fuses (eFuses), and a design structure on which the subject circuit resides are provided. A primary chip includes an adaptive power supply (APS). A secondary chip circuit includes at least one pair of hard-wired APS setting connections. Each hard-wired APS setting connection is defined by a selected one of a voltage supply connection and a ground potential connection. A respective inverter couples a control signal from each of the hard-wired APS setting connections to a power communication bus connected to the APS on the primary chip.
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