Invention Grant
- Patent Title: Three-dimensional networking structure
- Patent Title (中): 三维网络结构
-
Application No.: US11382967Application Date: 2006-05-12
-
Publication No.: US07865694B2Publication Date: 2011-01-04
- Inventor: Kerry Bernstein , Timothy J. Dalton , Marc R. Faucher , Peter A. Sandon
- Applicant: Kerry Bernstein , Timothy J. Dalton , Marc R. Faucher , Peter A. Sandon
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Michael LeStrange
- Main IPC: G06F15/76
- IPC: G06F15/76

Abstract:
A multi-layer silicon stack architecture includes one or more processing layers including one or more computing elements; one or more networking layers disposed between the processing layers, the network layer includes one or more networking elements, wherein each computing element includes a plurality of network connections to adjacently disposed networking elements.
Public/Granted literature
- US20070266129A1 THREE-DIMENSIONAL NETWORKING STRUCTURE Public/Granted day:2007-11-15
Information query