In some embodiments, an input measurement module may be configured to insert into a slot of a carrier using alignment guide slots and corresponding guide projections. Clips on the input measurement module or the carrier may engage corresponding depressions to secure the input measurement module to the carrier. The clips may be spring-loaded. The input measurement module may include a first outer casing and a second outer casing coupled together around a circuit board that interfaces with a backplane of the carrier through a backplane connector.