Invention Grant
- Patent Title: Apparatus and method for attaching substrates
-
Application No.: US11866877Application Date: 2007-10-03
-
Publication No.: US07864289B2Publication Date: 2011-01-04
- Inventor: Jae Seok Hwang , Kyung Mi Kim
- Applicant: Jae Seok Hwang , Kyung Mi Kim
- Applicant Address: KR
- Assignee: ADP Engineering Co., Ltd.
- Current Assignee: ADP Engineering Co., Ltd.
- Current Assignee Address: KR
- Agency: KED & Associates, LLP
- Priority: KR10-2006-0125002 20061208
- Main IPC: G02F1/1339
- IPC: G02F1/1339 ; B23K37/00

Abstract:
An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
Public/Granted literature
- US20080135127A1 APPARATUS AND METHOD FOR ATTACHING SUBSTRATES Public/Granted day:2008-06-12
Information query
IPC分类: