Invention Grant
US07864019B2 Wiring assembly and method of forming a channel in a wiring assembly for receiving conductor
有权
在用于接收导体的接线组件中形成通道的接线组件和方法
- Patent Title: Wiring assembly and method of forming a channel in a wiring assembly for receiving conductor
- Patent Title (中): 在用于接收导体的接线组件中形成通道的接线组件和方法
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Application No.: US12061813Application Date: 2008-04-03
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Publication No.: US07864019B2Publication Date: 2011-01-04
- Inventor: Rainer Meinke , Gerald Stelzer
- Applicant: Rainer Meinke , Gerald Stelzer
- Applicant Address: US FL Palm Bay
- Assignee: Advanced Magnet Lab, Inc.
- Current Assignee: Advanced Magnet Lab, Inc.
- Current Assignee Address: US FL Palm Bay
- Agency: Beusse, Wolter, Sanks, Mora & Maire, P.A.
- Agent Ferdinand M. Romano, Esq.
- Main IPC: H01F27/30
- IPC: H01F27/30

Abstract:
A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method provides a first layer that is tubular in shape with an outer surface along which a conductor may be positioned. A channel defining a first conductor path is formed in the first layer outer surface to create a pattern extending along the first layer. A first segment of conductor is placed in the first channel and defines a shape about an aperture region. After placing the first segment of conductor in the first channel, at least part of the first layer outer surface and at least part of the first segment of conductor are coated with a second layer. A second channel is formed along an outer surface of the second layer to define a second conductor path extending about the aperture region for placement of a second segment of conductor.
Public/Granted literature
- US20090251270A1 Wiring Assembly And Method of Forming A Channel In A Wiring Assembly For Receiving Conductor Public/Granted day:2009-10-08
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