Invention Grant
US07863917B2 Semiconductor chip having a crack test circuit and method of testing a crack of a semiconductor chip using the same
失效
具有裂纹测试电路的半导体芯片和使用其测试半导体芯片的裂纹的方法
- Patent Title: Semiconductor chip having a crack test circuit and method of testing a crack of a semiconductor chip using the same
- Patent Title (中): 具有裂纹测试电路的半导体芯片和使用其测试半导体芯片的裂纹的方法
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Application No.: US11797426Application Date: 2007-05-03
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Publication No.: US07863917B2Publication Date: 2011-01-04
- Inventor: Joo-Sung Park
- Applicant: Joo-Sung Park
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0040382 20060504
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A semiconductor chip includes a line structure arranged along a peripheral region of the semiconductor chip region in order to inspect a crack, a first pad and second pad arranged on different end portions of the line structure, a second pad arranged on another end portion of the line structure, an inspection device activated during a crack test mode to electrically connect the first pad, the line structure and the second pad. The inspection device may include a first switching circuit connected between the first pad and the line structure, the first switching circuit being deactivated during a normal operation mode and being activated a crack test mode; and a second switching circuit connected between the second pad and the line structure, the second switching circuit being deactivated during the normal operation mode and being activated during the crack test mode.
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