Invention Grant
- Patent Title: Integrated circuit package system with wire bond pattern
- Patent Title (中): 具有引线键合图案的集成电路封装系统
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Application No.: US11278414Application Date: 2006-04-01
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Publication No.: US07863737B2Publication Date: 2011-01-04
- Inventor: Byoung Wook Jang , Hun Teak Lee , Kwang Soon Hwang
- Applicant: Byoung Wook Jang , Hun Teak Lee , Kwang Soon Hwang
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.
Public/Granted literature
- US20070235869A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE BOND PATTERN Public/Granted day:2007-10-11
Information query
IPC分类:
