Invention Grant
- Patent Title: Package structure of integrated circuit device and manufacturing method thereof
- Patent Title (中): 集成电路器件的封装结构及其制造方法
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Application No.: US12396898Application Date: 2009-03-03
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Publication No.: US07863717B2Publication Date: 2011-01-04
- Inventor: Shih Hsiung Chan , Shen Bo Lin , Pin Chuan Chen
- Applicant: Shih Hsiung Chan , Shen Bo Lin , Pin Chuan Chen
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agent Raymond J. Chew
- Priority: TW097107608A 20080305
- Main IPC: H01L21/98
- IPC: H01L21/98
Abstract:
A package structure of an integrated circuit device comprises a copper foil substrate, an integrated circuit device, a plurality of metal wires and an encapsulation material. The copper foil substrate comprises an IC bonding area, a plurality of conductive areas and an insulating dielectric material. The integrated circuit device is mounted on the surface of the IC bonding area, and is electrically connected to the plurality of conductive areas through the metal wires. The insulating dielectric material is between the IC bonding area and the conductive areas, and is also between two adjacent conductive areas. In addition, the encapsulation material covers the IC bonding area, the conductive areas and the integrated circuit device.
Public/Granted literature
- US20090224385A1 PACKAGE STRUCTURE OF INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-09-10
Information query
IPC分类:
