Invention Grant
- Patent Title: Image sensor package and method of manufacturing the same
- Patent Title (中): 图像传感器封装及其制造方法
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Application No.: US11150825Application Date: 2005-06-10
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Publication No.: US07863702B2Publication Date: 2011-01-04
- Inventor: Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
- Applicant: Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2004-0042501 20040610; KR10-2005-0037018 20050503
- Main IPC: H01L29/78
- IPC: H01L29/78
Abstract:
An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
Public/Granted literature
- US20060006486A1 Image sensor package and method of manufacturing the same Public/Granted day:2006-01-12
Information query
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