Invention Grant
- Patent Title: Semiconductor sensor and method for manufacturing the same
- Patent Title (中): 半导体传感器及其制造方法
-
Application No.: US12336846Application Date: 2008-12-17
-
Publication No.: US07863696B2Publication Date: 2011-01-04
- Inventor: Teruo Takizawa , Takayuki Kondo , Masayoshi Todorokihara
- Applicant: Teruo Takizawa , Takayuki Kondo , Masayoshi Todorokihara
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2008-012925 20080123
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L21/00

Abstract:
A semiconductor sensor includes: a semiconductor substrate; a plurality of piezoelectric thin films layered on the semiconductor substrate, the plurality of piezoelectric thin films including at least a pair of the piezoelectric thin films layered above and below; a pair of electrodes that are formed at an interface of at least the pair of the piezoelectric thin films layered above and below and excite surface acoustic waves; a thin film directly under a lowest-layer piezoelectric film of the piezoelectric thin films; a metal thin film that is formed at an interface of the lowest-layer piezoelectric thin film and the thin film, and facilitate a growth of a ridge-and-valley portion on a surface of an uppermost-layer piezoelectric thin film of the piezoelectric thin films; and a sensitive film for molecular adsorption formed on at least the ridge-and-valley portion on the uppermost-layer piezoelectric thin film.
Public/Granted literature
- US20090184381A1 SEMICONDUCTOR SENSOR AND METHOD FOR MANUFACTRUING THE SAME Public/Granted day:2009-07-23
Information query
IPC分类: