Invention Grant
- Patent Title: Multiple-gate transistors formed on bulk substrates
- Patent Title (中): 形成在大量衬底上的多栅极晶体管
-
Application No.: US11645419Application Date: 2006-12-26
-
Publication No.: US07863674B2Publication Date: 2011-01-04
- Inventor: Yee-Chia Yeo , Fu-Liang Yang , Chenming Hu
- Applicant: Yee-Chia Yeo , Fu-Liang Yang , Chenming Hu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L31/062
- IPC: H01L31/062

Abstract:
In one aspect, the present invention teaches a multiple-gate transistor 130 that includes a semiconductor fin 134 formed in a portion of a bulk semiconductor substrate 132. A gate dielectric 144 overlies a portion of the semiconductor fin 134 and a gate electrode 146 overlies the gate dielectric 144. A source region 138 and a drain region 140 are formed in the semiconductor fin 134 oppositely adjacent the gate electrode 144. In the preferred embodiment, the bottom surface 150 of the gate electrode 146 is lower than either the source-substrate junction 154 or the drain-substrate junction 152.
Public/Granted literature
- US20070102763A1 Multiple-gate transistors formed on bulk substrates Public/Granted day:2007-05-10
Information query
IPC分类: