Invention Grant
- Patent Title: High breakdown voltage double-gate semiconductor device
- Patent Title (中): 高击穿电压双栅极半导体器件
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Application No.: US12070019Application Date: 2008-02-13
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Publication No.: US07863645B2Publication Date: 2011-01-04
- Inventor: Denis A. Masliah , Alexandre G. Bracale , Francis C. Huin , Patrice J. Barroul
- Applicant: Denis A. Masliah , Alexandre G. Bracale , Francis C. Huin , Patrice J. Barroul
- Applicant Address: US CA Sunnyvale
- Assignee: ACCO Semiconductor Inc.
- Current Assignee: ACCO Semiconductor Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Peters Verny, LLP
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A double-gate semiconductor device provides a high breakdown voltage allowing for a large excursion of the output voltage that is useful for power applications. The double-gate semiconductor device may be considered a double-gate device including a MOS gate and a junction gate, in which the bias of the junction gate may be a function of the gate voltage of the MOS gate. The breakdown voltage of the double-gate semiconductor device is the sum of the breakdown voltages of the MOS gate and the junction gate. Because an individual junction gate has an intrinsically high breakdown voltage, the breakdown voltage of the double-gate semiconductor device is greater than the breakdown voltage of an individual MOS gate. The double-gate semiconductor device provides improved RF capability in addition to operability at higher power levels as compared to conventional transistor devices. The double-gate semiconductor device may also be fabricated in a higher spatial density configuration such that a common implantation between the MOS gate and the junction gate is eliminated.
Public/Granted literature
- US20090200581A1 High breakdown voltage double-gate semiconductor device Public/Granted day:2009-08-13
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