Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
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Application No.: US12236575Application Date: 2008-09-24
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Publication No.: US07863529B2Publication Date: 2011-01-04
- Inventor: Nobuaki Hashimoto
- Applicant: Nobuaki Hashimoto
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2007-287634 20071105
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H05K5/06
Abstract:
An electronic component includes: a first substrate; a second substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; and a functional element at least a part of which is disposed in the sealing space. In the electronic component, the sealing member includes a core part formed on the first substrate and having elasticity and a metal film formed on a surface of the core part, and the metal film is bonded to the second substrate.
Public/Granted literature
- US20090114441A1 ELECTRONIC COMPONENT Public/Granted day:2009-05-07
Information query
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