Invention Grant
- Patent Title: Lead frame mount for circuit component
- Patent Title (中): 引线框架安装用于电路元件
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Application No.: US11939091Application Date: 2007-11-13
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Publication No.: US07863527B2Publication Date: 2011-01-04
- Inventor: Gaetan Vich
- Applicant: Gaetan Vich
- Applicant Address: US MI Auburn Hills
- Assignee: Continental Automotive Systems US, Inc.
- Current Assignee: Continental Automotive Systems US, Inc.
- Current Assignee Address: US MI Auburn Hills
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein.
Public/Granted literature
- US20080205015A1 LEAD FRAME MOUNT FOR CIRCUIT COMPONENT Public/Granted day:2008-08-28
Information query
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