Invention Grant
- Patent Title: Resin composition and molded article comprising the same
- Patent Title (中): 树脂组合物和包含其的模制品
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Application No.: US11663150Application Date: 2005-09-20
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Publication No.: US07863382B2Publication Date: 2011-01-04
- Inventor: Hiromitsu Ishii , Takashi Nagao , Hiroyuki Ohme
- Applicant: Hiromitsu Ishii , Takashi Nagao , Hiroyuki Ohme
- Applicant Address: JP Tokyo
- Assignee: Toray Industriés, Inc.
- Current Assignee: Toray Industriés, Inc.
- Current Assignee Address: JP Tokyo
- Agency: RatnerPrestia
- Priority: JP2004-272620 20040917; JP2005-213840 20050725
- International Application: PCT/JP2005/017274 WO 20050920
- International Announcement: WO2006/030951 WO 20060323
- Main IPC: C08F242/00
- IPC: C08F242/00

Abstract:
A resin composition in which a polylactic acid resin (A) 95-5 wt %, an aromatic polycarbonate resin (B) 5-95 wt %, and, with respect to 100 wt parts of the total of the (A) and the (B), at least one compatibilizer selected from a polymer compound containing an acrylic resin or styrene resin unit as a graft (C), a polymer compound to which a glycidyl compound or an acid anhydride is grafted or copolymerized (D) and an oxazoline compound, an oxazine compound and a carbodiimide compound (E) are compounded.
Public/Granted literature
- US20080262151A1 Resin Composition and Molded Article Comprising the Same Public/Granted day:2008-10-23
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