Invention Grant
- Patent Title: Mold compositions with high adhesion to metal substrates
- Patent Title (中): 对金属基材具有高粘附性的模具组合物
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Application No.: US11348505Application Date: 2006-02-07
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Publication No.: US07863346B2Publication Date: 2011-01-04
- Inventor: Stephen M. Dershem , Debbie Forray
- Applicant: Stephen M. Dershem , Debbie Forray
- Applicant Address: US CA San Diego
- Assignee: Designer Molecules, Inc.
- Current Assignee: Designer Molecules, Inc.
- Current Assignee Address: US CA San Diego
- Agency: The Law Office of Jane K. Babin, Professional Corporation
- Agent Jane K. Babin
- Main IPC: C08F299/04
- IPC: C08F299/04
Abstract:
The invention is based on the discovery that certain well-defined crosslinkable polyester compounds are useful as components in mold compositions having increased adhesion to substrates, compared to mold compositions that do not contain the crosslinkable polyester compounds described herein.
Public/Granted literature
- US20070299154A1 Mold compositions with high adhesion to metal substrates Public/Granted day:2007-12-27
Information query
