Invention Grant
- Patent Title: Gallium nitride semiconductor device
- Patent Title (中): 氮化镓半导体器件
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Application No.: US12249099Application Date: 2008-10-10
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Publication No.: US07863172B2Publication Date: 2011-01-04
- Inventor: TingGang Zhu , Bryan S. Shelton , Marek K. Pabisz , Mark Gottfried , Linlin Liu , Milan Pophristic , Michael Murphy , Richard A. Stall
- Applicant: TingGang Zhu , Bryan S. Shelton , Marek K. Pabisz , Mark Gottfried , Linlin Liu , Milan Pophristic , Michael Murphy , Richard A. Stall
- Applicant Address: US CA San Jose
- Assignee: Power Integrations, Inc.
- Current Assignee: Power Integrations, Inc.
- Current Assignee Address: US CA San Jose
- Agency: The Law Offices of Bradley J. Bereznak
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/47

Abstract:
A gallium nitride based semiconductor Schottky diode fabricated from a n+ doped GaN layer having a thickness between one and six microns disposed on a sapphire substrate; an n− doped GaN layer having a thickness greater than one micron disposed on said n+ GaN layer patterned into a plurality of elongated fingers and a metal layer disposed on the n− doped GaN layer and forming a Schottky junction therewith. The layer thicknesses and the length and width of the elongated fingers are optimized to achieve a device with breakdown voltage of greater than 500 volts, current capacity in excess of one ampere, and a forward voltage of less than three volts.
Public/Granted literature
- US20090035925A1 Gallium Nitride Semiconductor Device Public/Granted day:2009-02-05
Information query
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