Invention Grant
- Patent Title: Indirect-release electrolytic implant delivery systems
- Patent Title (中): 间接释放电解植入物输送系统
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Application No.: US11314151Application Date: 2005-12-20
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Publication No.: US07862602B2Publication Date: 2011-01-04
- Inventor: David Licata , Sudip R. Pandya
- Applicant: David Licata , Sudip R. Pandya
- Applicant Address: BM Hamilton
- Assignee: Biosensors International Group, Ltd
- Current Assignee: Biosensors International Group, Ltd
- Current Assignee Address: BM Hamilton
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: A61F2/06
- IPC: A61F2/06

Abstract:
Medical devices and methods for delivery or implantation of prostheses within hollow body organs and vessels or other luminal anatomy are disclosed. The subject technologies may be used in the treatment of atherosclerosis in stenting procedures or be used in variety of other procedures. The systems may employ a self expanding stent restrained by one or more members released by an electrolytically erodable latch. Such release means do not connect directly to the implant, though one or more portions may contact it.
Public/Granted literature
- US20070100415A1 Indirect-release electrolytic implant delivery systems Public/Granted day:2007-05-03
Information query
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