Invention Grant
- Patent Title: Self aligning die
- Patent Title (中): 自对准模具
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Application No.: US12022190Application Date: 2008-01-30
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Publication No.: US07862441B2Publication Date: 2011-01-04
- Inventor: Derek J. Nash
- Applicant: Derek J. Nash
- Applicant Address: US NC Huntersville
- Assignee: Irwin Industrial Tool Company
- Current Assignee: Irwin Industrial Tool Company
- Current Assignee Address: US NC Huntersville
- Agency: Moore & Van Allen, PLLC
- Agent Dennis J. Williamson
- Main IPC: B21J13/02
- IPC: B21J13/02 ; B21H3/02 ; B23G5/04
Abstract:
The die has a bore that is generally sized to fit onto a like-sized stud. Threads are formed on the interior of the bore for cutting the threads on the stud. The die includes an integrated alignment mechanism to ensure that the die is aligned with respect to the stud as the die is rotated onto the stud.
Public/Granted literature
- US20090191977A1 SELF ALIGNING DIE Public/Granted day:2009-07-30
Information query
