A repair device for a PCB includes a clamp portion having a plurality of receptacles defined therein, a connector head having a plurality of contacts configured to connect with the PCB, a plurality of conductive lines arranged side by side, and a lead wire. One end of each of the conductive lines is connected to the clamp portion and exposed to outside of the clamp portion via a corresponding receptacle of the clamp portion, the other end of each of the conductive lines is connected to a corresponding contact of the connector head. Two ends of the lead wire are electrically connected to two of the conductive lines via the corresponding receptacles, thereby switching signal transmission from one of the input terminals of the PCB to another input terminal of the PCB.