Invention Grant
- Patent Title: Heat treatment apparatus and heat treatment method using the same
- Patent Title (中): 热处理装置及使用其的热处理方法
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Application No.: US11510432Application Date: 2006-08-24
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Publication No.: US07862334B2Publication Date: 2011-01-04
- Inventor: Tae-Hoon Yang , Ki-Yong Lee , Jin-Wook Seo , Byoung-Keon Park
- Applicant: Tae-Hoon Yang , Ki-Yong Lee , Jin-Wook Seo , Byoung-Keon Park
- Applicant Address: KR
- Assignee: Samsung Mobile Display Co., Ltd.
- Current Assignee: Samsung Mobile Display Co., Ltd.
- Current Assignee Address: KR
- Agency: Knobbe Martens Olson & Bear LLC
- Priority: KR10-2005-0078362 20050825
- Main IPC: F27B9/00
- IPC: F27B9/00
Abstract:
A heat treatment apparatus and a heat treatment method using the same are disclosed. In the method, a support plate on which a device substrate is mounted is loaded into the heat treatment apparatus using a transfer unit in an in-line manner, and the device substrate mounted on the support plate is heat-treated using the heat treatment apparatus.
Public/Granted literature
- US20070049057A1 Heat treatment apparatus and heat treatment method using the same Public/Granted day:2007-03-01
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