Invention Grant
US07862153B2 Electrical wiring structure, liquid ejection head, liquid ejection apparatus and image forming apparatus
失效
电气布线结构，液体喷射头，液体喷射装置和图像形成装置
- Patent Title: Electrical wiring structure, liquid ejection head, liquid ejection apparatus and image forming apparatus
- Patent Title (中): 电气布线结构，液体喷射头，液体喷射装置和图像形成装置
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Application No.: US11882058Application Date: 2007-07-30
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Publication No.: US07862153B2Publication Date: 2011-01-04
- Inventor: Yasuhiko Maeda
- Applicant: Yasuhiko Maeda
- Applicant Address: JP Tokyo
- Assignee: FujiFilm Corporation
- Current Assignee: FujiFilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-208377 20060731
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
The electrical wiring structure includes an electrical connection section where a first electrode and a second electrode are connected, wherein: the electrical connection section is formed by a first alloy containing at least gallium metal; and the first alloy has a melting point lower than 30° C.
Public/Granted literature
- US20080024561A1 Electrical wiring structure, liquid ejection head, liquid ejection apparatus and image forming apparatus Public/Granted day:2008-01-31
Information query
IPC分类:
