Invention Grant
US07861913B2 Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor
失效
将半导体器件安装在布线板上以确保其间不变的间隙的焊接方法及其焊接装置
- Patent Title: Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor
- Patent Title (中): 将半导体器件安装在布线板上以确保其间不变的间隙的焊接方法及其焊接装置
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Application No.: US12232577Application Date: 2008-09-19
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Publication No.: US07861913B2Publication Date: 2011-01-04
- Inventor: Shinichi Miyazaki
- Applicant: Shinichi Miyazaki
- Applicant Address: JP Kawasaki, Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kawasaki, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2005-297586 20051012
- Main IPC: B23K1/06
- IPC: B23K1/06 ; B23K31/02
Abstract:
In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.
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