Invention Grant
- Patent Title: Method of and apparatus for working structure
- Patent Title (中): 工作结构的方法和装置
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Application No.: US11984768Application Date: 2007-11-21
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Publication No.: US07861624B2Publication Date: 2011-01-04
- Inventor: Shinya Kunimatsu , Hisayoshi Onishi , Makoto Matsuo
- Applicant: Shinya Kunimatsu , Hisayoshi Onishi , Makoto Matsuo
- Applicant Address: JP Kyoto
- Assignee: Towa Corporation
- Current Assignee: Towa Corporation
- Current Assignee Address: JP Kyoto
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-317162 20061124
- Main IPC: B23B3/00
- IPC: B23B3/00 ; B23B7/00

Abstract:
A mold material is mounted on a mold material mount portion of a cutting/working apparatus and rotated about the C-axis serving as the rotation center while a cutting tool is driven and moved in directions X and Y. Then, a desired position of the mold material is cut with the cutting tool at a relatively formed desired cutting speed and elliptically vibrated/cut with the cutting tool, for forming a Fresnel lens molding cavity having an opening of a desired shape and a working surface (concave surface, for example) of a desired shape. The productivity of an optical component mold employed as the structure can be efficiently improved when the mold for molding an optical component such as a Fresnel lens is worked by cutting the mold material employed as a workpiece with the cutting tool in a four-spindle lathe-type cutting/working apparatus including X-, Y-, Z- and C-axes of rotation.
Public/Granted literature
- US20080121078A1 Method of and apparatus for working structure Public/Granted day:2008-05-29
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