知搜-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US07861429B2 Thickness gauge 失效
厚度计

  • Patent Title: Thickness gauge
  • Patent Title (中): 厚度计
  • Application No.: US12327495
    Application Date: 2008-12-03
  • Publication No.: US07861429B2
    Publication Date: 2011-01-04
  • Inventor: Chia-En Lee
  • Applicant: Chia-En Lee
  • Applicant Address: HK Kowloon
  • Assignee: FIH (Hong Kong) Limited
  • Current Assignee: FIH (Hong Kong) Limited
  • Current Assignee Address: HK Kowloon
  • Agent Steven M. Reiss
  • Priority: CN200810302126 20080613
  • Main IPC: G01B3/50
  • IPC: G01B3/50
Thickness gauge
Abstract:
A thickness gauge (10) includes a main body (12), a plurality of measuring portions (14) defined along an edge of the main body (12), each measuring portion (14) having a different height, and a numerical pattern corresponding to the height of the measuring portion (14). The thickness gauge (10) only has one main body (12), so the material for making the measuring portions (14) can be reduced. Further more, the thickness gauge (10) is small, and easy to carry.
Abstract(Chinese):

厚度计（10）包括主体（12），沿着主体（12）的边缘限定的多个测量部分（14），每个测量部分（14）具有不同的高度，并且数字图案对应于 到测量部分（14）的高度。 厚度计（10）仅具有一个主体（12），因此可以减少用于制造测量部分（14）的材料。 此外，厚度计（10）小，易于携带。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0