Invention Grant
- Patent Title: Coupling module of a modular implantable medical device
- Patent Title (中): 模块化可植入医疗器械的耦合模块
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Application No.: US10731699Application Date: 2003-12-09
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Publication No.: US07848817B2Publication Date: 2010-12-07
- Inventor: Darren A. Janzig , Carl D. Wahlstrand , Robert M. Skime , Mark S. Lent , Keith A. Miesel , James E. Cabak
- Applicant: Darren A. Janzig , Carl D. Wahlstrand , Robert M. Skime , Mark S. Lent , Keith A. Miesel , James E. Cabak
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.
Public/Granted literature
- US20040172090A1 Coupling module of a modular implantable medical device Public/Granted day:2004-09-02
Information query
