Invention Grant
US07848814B2 System for transcutaneous energy transfer to an implantable medical device with mating elements
有权
用于经皮能量转移到具有配合元件的可植入医疗装置的系统
- Patent Title: System for transcutaneous energy transfer to an implantable medical device with mating elements
- Patent Title (中): 用于经皮能量转移到具有配合元件的可植入医疗装置的系统
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Application No.: US11590431Application Date: 2006-10-31
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Publication No.: US07848814B2Publication Date: 2010-12-07
- Inventor: Nathan A. Torgerson , John E. Kast , Kevin J. Kelly , Todd P. Goblish
- Applicant: Nathan A. Torgerson , John E. Kast , Kevin J. Kelly , Todd P. Goblish
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: IPLM Group, P.A.
- Main IPC: A61N1/378
- IPC: A61N1/378 ; A61N1/40
Abstract:
System for transcutaneous energy transfer to an implantable medical device adapted to be implanted under a cutaneous boundary having a housing having a first surface adapted to face the cutaneous boundary, the first surface of the housing of the implantable medical device having a first mating element, therapeutic componentry and a secondary coil operatively coupled to the therapeutic componentry. An external power source has housing having a first surface adapted to be placed closest to the cutaneous boundary, the first surface of the housing of the external power source having a second mating element and a primary coil capable of inductively energizing the secondary coil when externally placed in proximity of the secondary coil. The first mating element and the second mating element are configured to tactilely align the external power source with the implantable medical device.
Public/Granted literature
- US20070255350A1 System for transcutaneous energy transfer to an implantable medical device with mating elements Public/Granted day:2007-11-01
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