Invention Grant
- Patent Title: Method for aligning die to substrate
- Patent Title (中): 将裸片对准基板的方法
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Application No.: US12004621Application Date: 2007-12-24
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Publication No.: US07848002B2Publication Date: 2010-12-07
- Inventor: Hirotoshi Ichikawa , Fusao Ishii
- Applicant: Hirotoshi Ichikawa , Fusao Ishii
- Applicant Address: JP JP
- Assignee: Silicon Quest Kabushiki-Kaisha,Olympus Corporation
- Current Assignee: Silicon Quest Kabushiki-Kaisha,Olympus Corporation
- Current Assignee Address: JP JP
- Agent Bo-In Lin
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/08 ; H01L23/02
Abstract:
A method for aligning a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate and fixing the micro-mirror device die on the semiconductor substrate can be provided. The method comprises a first alignment step of aligning a first guide portion of the micro-mirror device die and a second guide portion of the package substrate and a fixing step of fixing the micro-mirror device die on the package substrate in a position aligned by the first alignment step using the first and second guide portions.
Public/Granted literature
- US20080212162A1 Method for aligning die to substrate Public/Granted day:2008-09-04
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