Invention Grant
- Patent Title: Multilayer microstripline transmission line transition
- Patent Title (中): 多层微带线传输线转换
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Application No.: US12180815Application Date: 2008-07-28
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Publication No.: US07847654B2Publication Date: 2010-12-07
- Inventor: Lance Dion Lascari
- Applicant: Lance Dion Lascari
- Applicant Address: US IL Broadview DE Stuttgart
- Assignee: Bosch Security Systems, Inc.,Robert Bosch GmbH
- Current Assignee: Bosch Security Systems, Inc.,Robert Bosch GmbH
- Current Assignee Address: US IL Broadview DE Stuttgart
- Agency: Taft Stettinius Hollister LLP
- Agent Keith J. Swedo, Esquire
- Main IPC: H03H7/38
- IPC: H03H7/38

Abstract:
A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.
Public/Granted literature
- US20100019859A1 Multilayer Microstripline Transmission Line Transition Public/Granted day:2010-01-28
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