Invention Grant
US07847586B2 Integrate circuit chip with magnetic devices 有权
集成电路芯片与磁性器件

Integrate circuit chip with magnetic devices
Abstract:
A logic gate array is provided. The logic gate comprises a silicon substrate, a first logic gate layer on top of the silicon substrate, a second logic gate layer on top of the first logic gate layer, and a routing layer between the first and second logic gate layers for routing magnetic gates in the first and second logic gate layers, wherein the first logic gate layer, the second logic gate layer, and the routing layer are electrically connected by vias.
Public/Granted literature
Information query
Patent Agency Ranking
0/0