Invention Grant
- Patent Title: Integrate circuit chip with magnetic devices
- Patent Title (中): 集成电路芯片与磁性器件
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Application No.: US11841193Application Date: 2007-08-20
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Publication No.: US07847586B2Publication Date: 2010-12-07
- Inventor: Tom Allen Agan , James Chyi Lai
- Applicant: Tom Allen Agan , James Chyi Lai
- Applicant Address: US MN St. Paul
- Assignee: Northern Lights Semiconductor Corp.
- Current Assignee: Northern Lights Semiconductor Corp.
- Current Assignee Address: US MN St. Paul
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Main IPC: H03K19/173
- IPC: H03K19/173 ; H01L25/00

Abstract:
A logic gate array is provided. The logic gate comprises a silicon substrate, a first logic gate layer on top of the silicon substrate, a second logic gate layer on top of the first logic gate layer, and a routing layer between the first and second logic gate layers for routing magnetic gates in the first and second logic gate layers, wherein the first logic gate layer, the second logic gate layer, and the routing layer are electrically connected by vias.
Public/Granted literature
- US20090051386A1 Integrate Circuit Chip with Magnetic Devices Public/Granted day:2009-02-26
Information query
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