Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card 2 has a contactor 11 for supporting a probe 10, a printed wiring board 13 electrically connected to the contactor 11, and a reinforcement member 14. On the upper surface side of the probe card 2 is provided a top plate 70 connected to the reinforcement member 14 by a connection member 80. A groove 90 is formed in the upper surface of the top plate 70, and a strain gauge 91 is attached at the groove 90. When a wafer W and the probe 10 are in contact with each other, an upward load acts on the probe card 2 by pressure caused by the contact, and the load causes strain in the top plate 70. The amount of the strain in the top plate 70 is measured, and contact pressure between the wafer W and the probe 10 is regulated and set based on the amount of the strain.