Invention Grant
US07847361B2 Solid state imaging device in which a plurality of imaging pixels are arranged two-dimensionally, and a manufacturing method for the solid state imaging device 有权
其中多个成像像素被二维布置的固态成像装置和用于固态成像装置的制造方法

  • Patent Title: Solid state imaging device in which a plurality of imaging pixels are arranged two-dimensionally, and a manufacturing method for the solid state imaging device
  • Patent Title (中): 其中多个成像像素被二维布置的固态成像装置和用于固态成像装置的制造方法
  • Application No.: US12167618
    Application Date: 2008-07-03
  • Publication No.: US07847361B2
    Publication Date: 2010-12-07
  • Inventor: Noboru Kokusenya
  • Applicant: Noboru Kokusenya
  • Applicant Address: JP Osaka
  • Assignee: Panasonic Corporation
  • Current Assignee: Panasonic Corporation
  • Current Assignee Address: JP Osaka
  • Agency: McDermott Will & Emery LLP
  • Priority: JP2007-183165 20070712
  • Main IPC: H01L31/0232
  • IPC: H01L31/0232
Solid state imaging device in which a plurality of imaging pixels are arranged two-dimensionally, and a manufacturing method for the solid state imaging device
Abstract:
A solid state imaging device includes a plurality of imaging pixels that are arranged two-dimensionally along a main face of a semiconductor substrate. Each imaging pixel in the solid state imaging device includes a photodiode that performs photoelectric conversion and a color filter that is disposed higher in the Z axis direction than the photodiode. Also, light blocking portions have been formed between pairs of adjacent imaging pixels, on the main face of the semiconductor substrate to a height in a thickness direction (Z axis direction) of the semiconductor substrate that is substantially equal to or higher than top edges of the optical filters. Each light blocking portion is constituted from a combination of a light blocking film and a light blocking wall.
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