Invention Grant
- Patent Title: Semiconductor device with strain in channel region and its manufacture method
- Patent Title (中): 通道区应变半导体器件及其制造方法
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Application No.: US12057427Application Date: 2008-03-28
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Publication No.: US07847281B2Publication Date: 2010-12-07
- Inventor: Takashi Mimura , Atsushi Yamada
- Applicant: Takashi Mimura , Atsushi Yamada
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/072 ; H01L31/0336 ; H01L31/0328 ; H01L31/109

Abstract:
A first film made of SiGe is formed over a support substrate whose surface layer is made of Si. A gate electrode is formed over a partial area of the first film, and source and drain regions are formed in the surface layer of the support substrate on both sides of the gate electrode. The gate electrode and source and drain regions constitute a first field effect transistor. A first stressor internally containing compressive strain or tensile strain is formed over the first film on both sides of the gate electrode of the first field effect transistor. The first stressor forms strain in a channel region.
Public/Granted literature
- US20080303062A1 SEMICONDUCTOR DEVICE WITH STRAIN IN CHANNEL REGION AND ITS MANUFACTURE METHOD Public/Granted day:2008-12-11
Information query
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