Invention Grant
- Patent Title: Planar programmable metallization memory cells
- Patent Title (中): 平面可编程金属化存储单元
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Application No.: US12233770Application Date: 2008-09-19
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Publication No.: US07847278B2Publication Date: 2010-12-07
- Inventor: Antoine Khoueir , Haiwen Xi , Shuiyuan Huang
- Applicant: Antoine Khoueir , Haiwen Xi , Shuiyuan Huang
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Scotts Valley
- Agency: Campbell Nelson Whipps LLC
- Main IPC: H01L47/00
- IPC: H01L47/00

Abstract:
Programmable metallization memory cells that have an inert electrode and an active electrode positioned in a non-overlapping manner in relation to a substrate. A fast ion conductor material is in electrical contact with and extends from the inert electrode to the active electrode, the fast ion conductor including superionic clusters extending from the inert electrode to the active electrode. A metal layer extends from the inert electrode to the active electrode, yet is electrically insulated from each of the inert electrode and the active electrode by the fast ion conductor material. Methods for forming programmable metallization cells are also disclosed.
Public/Granted literature
- US20100072448A1 PLANAR PROGRAMMABLE METALLIZATION MEMORY CELLS Public/Granted day:2010-03-25
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