Invention Grant
- Patent Title: In-situ thermal margining of computer systems for enhanced reliability testing
- Patent Title (中): 计算机系统的原位热裕度增强可靠性测试
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Application No.: US11787026Application Date: 2007-04-12
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Publication No.: US07809984B2Publication Date: 2010-10-05
- Inventor: Kalyanaraman Vaidyanathan , Kenny C. Gross
- Applicant: Kalyanaraman Vaidyanathan , Kenny C. Gross
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood Shores
- Agency: Park, Vaughan & Fleming LLP
- Agent Anthony P. Jones
- Main IPC: G06F11/00
- IPC: G06F11/00
Abstract:
Embodiments of the present invention provide a system that dynamically controls a temperature profile within a computer system by generating computer system activity. The system starts by receiving a desired temperature profile. The system then generates a load profile based on the desired temperature profile, wherein the load profile specifies operations to be performed by the computer system. The system next executes the load profile on the computer system to generate computer system activity, wherein the computer system activity causes the desired temperature profile in the computer system.
Public/Granted literature
- US20080255710A1 In-situ thermal margining of computer systems for enhanced reliability testing Public/Granted day:2008-10-16
Information query
