Invention Grant
- Patent Title: Two-wavelength semiconductor laser device and its fabricating method
- Patent Title (中): 双波长半导体激光器件及其制造方法
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Application No.: US12269583Application Date: 2008-11-12
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Publication No.: US07809042B2Publication Date: 2010-10-05
- Inventor: Kouji Makita , Takayuki Kashima
- Applicant: Kouji Makita , Takayuki Kashima
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-004278 20080111
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A two-wavelength semiconductor laser device includes a first semiconductor laser device including a first-conductivity type first cladding layer, a first guide layer made of AlGaAs mixed crystal, a first quantum well active layer having a barrier layer made of AlGaAs mixed crystal, a second guide layer made of AlGaAs mixed crystal, and a second-conductivity type second cladding layer, and a second semiconductor laser device including a first-conductivity type third cladding layer, a third guide layer made of AlGaInP mixed crystal, a second quantum well active layer having a barrier layer made of AlGaInP mixed crystal, a fourth guide layer made of AlGaInP mixed crystal, and a second-conductivity type fourth cladding layer. At least the barrier layer included in the first quantum well active layer, the first guide layer, and the second guide layer each have an Al molar ratio of more than 0.47 and 0.60 or less.
Public/Granted literature
- US20090180508A1 TWO-WAVELENGTH SEMICONDUCTOR LASER DEVICE AND ITS FABRICATING METHOD Public/Granted day:2009-07-16
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