Invention Grant
- Patent Title: Structure and method to form a heat sink
- Patent Title (中): 结构和方法形成一个散热片
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Application No.: US11982630Application Date: 2007-11-02
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Publication No.: US07808789B2Publication Date: 2010-10-05
- Inventor: Stephen Arthur McKeown , Gary Geno Stefani , David Reed Benedict , Andrew Karl Crane
- Applicant: Stephen Arthur McKeown , Gary Geno Stefani , David Reed Benedict , Andrew Karl Crane
- Applicant Address: US NY Johnson City
- Assignee: BAE Systems Controls Inc.
- Current Assignee: BAE Systems Controls Inc.
- Current Assignee Address: US NY Johnson City
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Paul J. Esatto, Jr.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/26 ; H01L23/34 ; B21D53/02
Abstract:
The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.
Public/Granted literature
- US20090116198A1 Structure and method to form a heat sink Public/Granted day:2009-05-07
Information query
