To provide electronic parts having a platy terminal secured through a conductive adhesive layer onto a device, which electronic parts are low in ESR and excel in the bonding strength between device and terminal. The conductive adhesive contains a flat conductive member and an organic solvent and is characterized in that through vaporization of the organic solvent in vacuum atmosphere, the flat conductive member has a region standing in the direction of thickness of the conductive adhesive layer. Further, the conductive adhesive is characterized by containing portion wherein the angle between the platy terminal and the flat plane of conductive member is ≧45°.