Invention Grant
- Patent Title: Varactors including interconnect layers
- Patent Title (中): 变压器包括互连层
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Application No.: US12217239Application Date: 2008-07-02
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Publication No.: US07808765B2Publication Date: 2010-10-05
- Inventor: Xubai Zhang , Louise C. Sengupta , Jason Sun , Nicolaas DuToit
- Applicant: Xubai Zhang , Louise C. Sengupta , Jason Sun , Nicolaas DuToit
- Applicant Address: US NH Nashua
- Assignee: Paratek Microwave, Inc.
- Current Assignee: Paratek Microwave, Inc.
- Current Assignee Address: US NH Nashua
- Agency: Guntin Meles & Gust, PLC.
- Agent Andrew Gust; Ed Guntin
- Main IPC: H01G5/00
- IPC: H01G5/00
Abstract:
In an embodiment of the present invention is provided a varactor comprising a substrate, a bottom electrode positioned on a surface of the substrate, a tunable dielectric material positioned adjacent to and extending over the bottom electrode forming a step and in contact with a top electrode, and an interconnect layer in contact with the bottom electrode, the tunable dielectric and the top electrode.
Public/Granted literature
- US20080297973A1 Varactors including interconnect layers Public/Granted day:2008-12-04
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